http://www.coolinnovations.comWhile today's high-end ICs offer exceptional processing capabilities, they also generate heavy loads of heat. Providing adequate cooling ...
Using PIM for the manufacture of heat sinks instead of extrusion or machining broadens geometry options and creates a dense structure. Figure 1. A plot of thermal conductivity vs. thermal expansion ...
Electronic devices, including those in telecommunications and high-power systems, generate heat during normal operation. That heat must be dissipated to avoid junction temperatures exceeding tolerable ...
A line of hybrid pin-fin heat sinks are made from an array of forged aluminum pin-fin heat sinks that are reflowed onto a copper plate. The hybrid pin fins are available in a wide array of standard ...
Apple recently took the wraps off its iPhone 15 series at its Fall event. The top flagship models reported overheating issues soon after, and several reports hinted that it could be due to its ...
TODAY'S CUTTING EDGE INTEGRATED CIRCUITS DISSIPATE SUBSTANTIALLY HEAVIER LOADS OF HEAT THAN EVER BEFORE. At the same time, the premium associated with miniaturized applications has never been greater, ...
If you have high-powered LEDs, or a power supply, or are trying to control larger motors, you have to get a lot of heat out of your circuit boards. The classic way to dissipate heat is to bolt your ...
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